Renesas Electronics
Slug:
renesaselectronics
Domain: renesas.com
Industry: Semiconductors
· Technology
Size: 10000+
Jobs (FK): 3183
Website: renesas.com
·
Careers page
Company profile
- HQ
- Tokyo , Tokyo , Japan
- Social
3183 jobs for this company
| ID | Title | Location | Country | State | Workplace | Status | Employment | Salary min | Salary max | Currency | Period | First seen | Posted | Last seen | Contacts | Link |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 10627185 | Sr Staff Digital Verfication Engineer | Shanghai, , China | China | — | Onsite | inactive | Full-time | — | — | — | — | July 29, 2026, 1:29 a.m. | July 3, 2026, 10:17 a.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 10627153 | Sr Staff Communications Specialist | Toyosu, , Japan | Japan | — | Onsite | inactive | Full-time | — | — | — | — | July 29, 2026, 1:29 a.m. | July 7, 2026, 10:10 a.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 10627140 | Intern, Process Engineering | Bayan Lepas, , Malaysia | Malaysia | — | Onsite | inactive | Intern | — | — | — | — | July 29, 2026, 1:29 a.m. | July 8, 2026, 8:07 a.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 10627037 | シニアスタッフアナログエンジニア､レイアウトデザイン | Takasaki, , Japan | Japan | — | Onsite | inactive | Full-time | — | — | — | — | July 29, 2026, 1:29 a.m. | July 13, 2026, 9:48 a.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 10626873 | Sr Staff CQE- AI Customers | Taipei, , Taiwan | Taiwan | — | Onsite | inactive | Full-time | — | — | — | — | July 29, 2026, 1:29 a.m. | July 16, 2026, 8:28 a.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 10626855 | Power Module Design Engineer (服务器电源模块工程师) | Shanghai, , China | China | — | Onsite | inactive | Full-time | — | — | — | — | July 29, 2026, 1:29 a.m. | July 17, 2026, 7:35 a.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 10626853 | Sr Staff Procurement/Purchasing Specialist - experienced for Passive Component is required | Taipei, , Taiwan | Taiwan | — | Onsite | inactive | Full-time | — | — | — | — | July 29, 2026, 1:29 a.m. | July 17, 2026, 8:45 a.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 10626852 | Sr Staff Procurement/Purchasing Specialist - experienced for Passive Component is required | Zhubei, Hsinchu County, Taiwan | Taiwan | — | Onsite | inactive | Full-time | — | — | — | — | July 29, 2026, 1:29 a.m. | July 17, 2026, 8:46 a.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 10626817 | Diffusion Equipment Engineer | Palm Bay, Florida, United States | United States | FL | Onsite | inactive | Full-time | — | — | — | — | July 29, 2026, 1:29 a.m. | July 20, 2026, 3:33 p.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 16212977 | Staff / Sr Test Operations Engineer - OSAT | Singapore, , Singapore | Singapore | — | Onsite | inactive | Full-time | — | — | — | — | Aug. 8, 2026, 1:24 a.m. | Aug. 7, 2026, 6:50 a.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 12381512 | Director of Advanced IC Packaging Development | San Jose, CALIFORNIA, United States | United States | CA | Hybrid | inactive | Full-time | — | — | — | — | Aug. 1, 2026, 1:33 a.m. | July 31, 2026, 12:35 p.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 22265350 | HPC Quality Leader for Automotive SoC (R‑Car) Design Team | Kodaira, , Japan | Japan | — | Onsite | inactive | Full-time | — | — | — | — | Aug. 19, 2026, 1:19 a.m. | Aug. 18, 2026, 11:56 a.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 21734447 | (Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power … | Taichung, Taichung City, Taiwan | Taiwan | — | Onsite | inactive | Full-time | — | — | — | — | Aug. 18, 2026, 1:13 a.m. | Aug. 17, 2026, 3:09 a.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 21734446 | (Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power … | Shanghai, Shanghai, China | China | — | Onsite | inactive | Full-time | — | — | — | — | Aug. 18, 2026, 1:13 a.m. | Aug. 17, 2026, 6:44 a.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 21734445 | (Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power … | Suzhou, Jiangsu, China | China | — | Onsite | inactive | Full-time | — | — | — | — | Aug. 18, 2026, 1:13 a.m. | Aug. 17, 2026, 6:44 a.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 20042217 | Regional Business lead/ Product Line Manager -Low end automotive MCU | Shanghai, Shanghai, China | China | — | Onsite | inactive | Full-time | — | — | — | — | Aug. 15, 2026, 1:14 a.m. | Aug. 14, 2026, 2:14 a.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 20042212 | (Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power … | Zhubei, , Taiwan | Taiwan | — | Onsite | inactive | Full-time | — | — | — | — | Aug. 15, 2026, 1:14 a.m. | Aug. 14, 2026, 4:10 a.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 20042211 | (Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power … | Taipei, , Taiwan | Taiwan | — | Onsite | inactive | Full-time | — | — | — | — | Aug. 15, 2026, 1:14 a.m. | Aug. 14, 2026, 4:17 a.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 20042206 | Staff Validation Engineer | Shanghai, , China | China | — | Onsite | inactive | Full-time | — | — | — | — | Aug. 15, 2026, 1:14 a.m. | Aug. 14, 2026, 8:58 a.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 19532331 | Staff Sales account Mgr- (Sales experience managing Auto customer or Sales role for Aut… | Shanghai, , China | China | — | Onsite | inactive | Full-time | — | — | — | — | Aug. 14, 2026, 1:14 a.m. | Aug. 13, 2026, 7:37 a.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 19532309 | Senior System SW validation engineer | Plano, TX, United States | United States | TX | Onsite | inactive | Full-time | — | — | — | — | Aug. 14, 2026, 1:14 a.m. | Aug. 13, 2026, 5:58 p.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 19532302 | Senior Sales Account Manager | San Jose, CALIFORNIA, United States | United States | CA | Onsite | inactive | Full-time | — | — | — | — | Aug. 14, 2026, 1:14 a.m. | Aug. 13, 2026, 9:43 p.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 18933385 | Staff Package Design Engineer - Substrate 封装设计专家（基板方向） | Shanghai, Shanghai, China | China | — | Onsite | inactive | Full-time | — | — | — | — | Aug. 13, 2026, 1:18 a.m. | Aug. 12, 2026, 7:06 a.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 18933384 | Staff Package Design Engineer - Substrate 封装设计专家（基板方向） | Suzhou, Jiangsu, China | China | — | Onsite | inactive | Full-time | — | — | — | — | Aug. 13, 2026, 1:18 a.m. | Aug. 12, 2026, 7:08 a.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |
| 18933383 | Staff Package Design Engineer - Cu FSM/BGBM/Bumping 封装设计专家 | Shanghai, , China | China | — | Onsite | inactive | Full-time | — | — | — | — | Aug. 13, 2026, 1:18 a.m. | Aug. 12, 2026, 7:23 a.m. | Aug. 31, 2026, 1:15 a.m. | — | Open |